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ILX550K 10680 pixel x 3 line CCD Linear Sensor (Color) Description The ILX550K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 1200DPI. Features * Number of effective pixels: 32040 pixels (10680 pixels x 3) * Pixel size: 4m x 4m (4m pitch) * Distance between line: 32m (8 lines) * Single-sided readout * Ultra low lag/High sensitivity * Single 12V power supply * Maximum data rate: 5MHz/Color * Input Clock Pulse: CMOS 5V drive * Number of output: 3 (R, G, B) * Package: 24 pin Plastic DIP (400mil) Absolute Maximum Ratings 15 * Supply voltage VDD * Operating temperature -10 to +55 Pin Configuration (Top View) Driver Driver Driver GND GND VDD RS 1 2 1 2 10 CCD register 3 VOUT-R 20 5 2 Output amplifier Output amplifier 1 VOUT-B 21 Output amplifier 24 11 15 Read out gate 24 pin DIP (Plastic) Block Diagram 12 ROG-G 16 ROG-R 13 ROG-B CCD register Blue D69 S1 D18 D19 S10680 D70 D74 D75 V C 1 RS GND VOUT-G VDD NC NC NC NC 1 1 1 1 2 3 4 5 6 G R B 7 8 9 24 2 GND D74 D75 CCD register Read out gate 21 VOUT-B 20 VOUT-R 19 NC 18 NC 17 NC CLP 16 ROG-R 15 2 10680 10680 10680 14 NC 13 ROG-B 23 GND 10 1 11 ROG-G 12 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- VOUT-G 4 Read out gate Green D69 S1 D18 D19 Red S10680 D70 S10680 D70 22 GND D74 D75 22 23 CLP D69 S1 D18 D19 E00420-PS ILX550K Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 Symbol 1 RS GND VOUT-G VDD NC NC NC NC GND 1 ROG-G Description Clock pulse input Clock pulse input GND Signal output (green) 12V power supply NC NC NC NC GND Clock pulse input Clock pulse input Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Symbol ROG-B NC 2 ROG-R NC NC NC VOUT-R VOUT-B GND CLP 2 Description Clock pulse input NC Clock pulse input Clock pulse input NC NC NC Signal output (red) Signal output (blue) GND Clock pulse input Clock pulse input Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V Clock Characteristics Item Input capacity of 1, 2 Input capacity of RS Input capacity of CLP Input capacity of ROG Symbol C1, C2 CRS CCLP CROG Min. -- -- -- -- Typ. 500 10 10 10 Max. -- -- -- -- Unit pF pF pF pF Clock Frequency Item Frequency of 1, 2, RS, CLP Symbol f1, f2, fRS, fCLP Min. -- Typ. 1 Max. 5 Unit MHz Input Clock Pulse Voltage Condition Item 1, 2, RS, CLP, ROG pulse voltage High level Low level Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V -2- ILX550K Electrooptical Characteristics (Note 1) (Ta = 25C, VDD = 12V, fRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Red Sensitivity Green Blue Sensitivity nonuniformity Saturation output voltage Red Saturation exposure Green Blue Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE Zo VOS Min. 1.8 2.1 1.7 -- 2 0.56 0.44 0.57 -- -- -- -- 92 -- -- Typ. 2.7 3.3 2.6 4 2.5 0.93 0.76 0.96 2 4 0.02 25 98 450 7.3 Max. 3.6 4.5 3.5 20 -- -- -- -- 5 12 -- 50 -- -- -- mV mV % mA % V Note 8 Note 6 Note 6 Note 7 lx * s Note 5 % V Note 3 Note 4 V/(lx * s) Note 2 Unit Remarks Notes) 1. In accordance with the given electrooptical characteristics, the black level is defined as the average value of D18, D19 to D67. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT-G = 500mV (Typ.) PRNU = (VMAX - VMIN)/2 VAVE x 100 [%] Where the 5340 pixels are divided into blocks of 100, the maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT R , VOS GND Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6. Optical signal accumulated time int stands at 5.5ms. 7. VOUT-G = 500mV (Typ.) VOUT 8. Vos is defined as indicated below. VOUT indicates VOUT-R, VOUT-G and VOUT-B. -3- Clock Timing Chart 1 ROG 5 0 1 2 3 4 1 5 0 2 5 0 RS 5 D71 D74 D70 D69 S1 S2 D18 D19 D1 D2 D3 VOUT Optical black (50 pixels) Dummy signal (69 pixels) D17 1-line output period (10755 pixels) , , D67 D68 S10678 S10679 S10680 D75 -4- 0 CLP 5 0 Note) The transfer pulses (1, 2) must have more than 10755 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B. ROG indicates ROG-R, ROG-G, ROG-B. ILX550K 10755 ILX550K Clock Timing Chart 2 t4 t5 ROG t6 t2 t7 1 t1 t3 2 Clock Timing Chart 3 t7 1 t6 2 t9 RS t10 t8 t14 t15 t16 CLP t17 t13 VOUT , , t11 t12 -5- ILX550K Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time RS pulse high level period RS pulse rise time RS pulse fall time Signal output delay time CLP pulse high level period CLP pulse timing CLP pulse rise time CLP pulse fall time Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 Min. 50 3 1 0 0 0 0 30 0 0 -- -- 40 40 10 0 0 Typ. 100 5 2 5 5 20 20 501 20 20 50 20 100 100 50 20 20 Max. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Unit ns s s ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 These timing is the recommended condition under fRS = 1MHz. -6- Application Circuit 2 CLP 5.1k VOUT-B VOUT-R IC1 Tr1 5.1k ROG-R ROG-B 2 IC1 Tr1 100 100 100 100 2 100 2 24 22 NC NC NC 2 GND VOUT-B VOUT-R ROG-R CLP 23 21 20 19 18 17 16 15 14 NC 13 ROG-B 1 2 RS GND VOUT-G VDD NC NC NC NC GND 1 12V 2 4 3 5 6 7 1 8 9 10 11 0.1F 100 Tr1 VOUT-G RS 5.1k 47F/16V 2 100 2 IC1 IC1: 74AC04 Tr1: 2SC2785 1 100 IC1 1 ROG-G Data rate fRS = 1MHz ILX550K Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. ROG-G 12 -7- ILX550K Example of Representative Characteristics (VDD = 12V, Ta = 25C) Spectral sensitivity characteristics (Standard characteristics) 1.0 0.8 Relative sensitivity 0.6 0.4 0.2 0 400 450 500 550 600 Wavelength [nm] 650 700 Dark voltage rate vs. Ambient temperature (Standard characteristics) 100 10 Output voltage rate vs. Integration time (Standard characteristics) 10 Output voltage rate 0 10 20 30 40 50 Ta - Ambient temperature [C] 60 Dark voltage rate 1 1 0.1 -10 0.1 1 5 int - Integration time [ms] 10 Offset level vs. Supply voltage (Standard characteristics) 10 Ta = 25C 8 Vos - Offset level [V] Vos - Offset level [V] 8 10 Offset level vs. Ambient temperature (Standard characteristics) 6 6 4 Vos 0.7 VDD 2 4 Vos 1mV/ C Ta 2 0 11.4 12 VDD - Supply voltage [V] 12.6 0 -10 0 10 20 30 40 50 Ta - Ambient temperature [C] 60 -8- ILX550K Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass 0.9Nm , , Plastic portion 39N 29N 29N Ceramic portion Adhesive (1) (2) (3) (4) , , , , , , , , , , , , b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. -9- ILX550K 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 10 - Package Outline Unit: mm 24pin SDIP(400mil) 55.7 0.3 24 13 10.0 0.3 4.0 0.5 5.0 0.3 1 12 0.3 M 1. The height from the bottom to the sensor surface is 2.38 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. PACKAGE STRUCTURE PACKAGE MATERIAL Plastic,Ceramic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42ALLOY PACKAGE MASS 5.43g Sony Corporation DRAWING NUMBER LS-B25-01(E) 4.28 0.5 1.778 5.334 0.46 3.58 0.25 H No.1Pixel (Green) 10.16 V 0 to 9 7.8 0.3 42.72 (4mX10680pixels) - 11 - ILX550K |
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